MPVZ5050 Просмотр технического описания (PDF) - Freescale Semiconductor
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MPVZ5050
Freescale Semiconductor
MPVZ5050 Datasheet PDF : 18 Pages
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On-chip Temperature Compensation and Calibration
Pressure
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5050/MPXV5050G series pressure sensor
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability. Contact the
factory for information regarding media compatibility in your
application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0× to 85×C using the decoupling circuit shown in Figure 4.
The output will saturate outside of the specified pressure
range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
5.0
4.5 Transfer Function:
Vout = VS*(0.018*P+0.04) ± ERROR
4.0 VS = 5.0 Vdc
3.5 TEMP = 0 to 85°C
3.0
TYPICAL
2.5
MAX
2.0
MIN
1.5
1.0
0.5
0
0 5 10 15 20 25 30 35 40 45 50 55
Differential Pressure (kPa)
Figure 2. Output vs. Pressure Differential
Fluorosilicone
Gel Die Coat
Die
P1
Wire Bond
Stainless Steel
Metal Cover
Epoxy
Plastic
Case
Lead Frame
Die
Differential/Gauge Element
Bond
P2
Figure 3. Cross-Sectional Diagram (not to scale)
+5 V
1.0 μF
Vout
Vs
IPS
0.01 μF
GND
OUTPUT
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
Sensors
Freescale Semiconductor
MPX5050
5
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