MPX2100 Просмотр технического описания (PDF) - Freescale Semiconductor
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MPX2100
Freescale Semiconductor
MPX2100 Datasheet PDF : 8 Pages
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Freescale Semiconductor, Inc.
MPX2100 SERIES
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
PACKAGE DIMENSIONS
C
B
J
R
M
–A–
PIN 1
1234
N
L
–T–
SEATING
PLANE
G
F
D 4 PL
0.136 (0.005) M T A M
Z
1 2 34
F
Y
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. “F” 8 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
DIM MIN MAX
A 0.595 0.630
B 0.514 0.534
C 0.200 0.220
D 0.016 0.020
F 0.048 0.064
G 0.100 BSC
J 0.014 0.016
L 0.695 0.725
M
30_ NOM
N 0.475 0.495
R 0.430 0.450
Y 0.048 0.052
Z 0.106 0.118
MILLIMETERS
MIN MAX
15.11 16.00
13.06 13.56
5.08 5.59
0.41 0.51
1.22 1.63
2.54 BSC
0.36 0.40
17.65 18.42
30_ NOM
12.07 12.57
10.92 11.43
1.22 1.32
2.68 3.00
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
STYLE 2:
PIN 1. VCC
2. - SUPPLY
3. + SUPPLY
4. GROUND
STYLE 3:
PIN 1. GND
2. -VOUT
3. VS
4. +VOUT
CASE 344–15
ISSUE Z
SEATING
PLANE
–T–
R
J
C
–A–
U
L
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
B
PIN 1
–P–
0.25 (0.010) M T Q S
12 34
F
G
D 4 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: INCH.
–Q–
K
S
INCHES
DIM MIN MAX
A 1.145 1.175
B 0.685 0.715
C 0.305 0.325
D 0.016 0.020
F 0.048 0.064
G 0.100 BSC
H 0.182 0.194
J 0.014 0.016
K 0.695 0.725
L 0.290 0.300
N 0.420 0.440
P 0.153 0.159
Q 0.153 0.159
R 0.230 0.250
S 0.220 0.240
U
0.910 BSC
MILLIMETERS
MIN MAX
29.08 29.85
17.40 18.16
7.75 8.26
0.41 0.51
1.22 1.63
2.54 BSC
4.62 4.93
0.36 0.41
17.65 18.42
7.37 7.62
10.67 11.18
3.89 4.04
3.89 4.04
5.84 6.35
5.59 6.10
23.11 BSC
0.13 (0.005) M T S S Q S
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B–01
ISSUE B
Motorola Sensor Device Data For More Information On This Product,
5
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