MPX2100 Просмотр технического описания (PDF) - Freescale Semiconductor
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MPX2100
Freescale Semiconductor
MPX2100 Datasheet PDF : 8 Pages
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LINEARITY
Freescale Semiconductor, Inc.
MPX2100 SERIES
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
LEAST SQUARES FIT
EXAGGERATED
PERFORMANCE
CURVE
LEAST
SQUARE
DEVIATION
STRAIGHT LINE
DEVIATION
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
END POINT
specified pressure sensor linearities are based on the end
STRAIGHT LINE FIT
point straight line method measured at the midrange
pressure.
OFFSET
0
50
100
PRESSURE (% FULLSCALE)
Figure 2. Linearity Specification Comparison
ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the MPX2100
series at 25°C. The output is directly proportional to the
differential pressure and is essentially a straight line.
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteris-
tics.
40
35
30
25
20
15
10
5
0
kPa -ā5 0
PSI
VS = 10 Vdc
TA = 25°C
P1 > P2
MAX
25
3.62
TYP
MIN
50
75
7.25
10.87
SPAN
RANGE
(TYP)
OFFSET
100
(TYP)
14.5
Figure 3. Output versus Pressure Differential
SILICONE GEL
DIE COAT
DIFFERENTIAL/GAUGE
DIE
STAINLESS STEEL
METAL COVER
P1
WIRE BOND
EPOXY
CASE
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT
DIE
BOND
P2
SILICONE GEL
DIE COAT
ABSOLUTE
DIE
STAINLESS STEEL
METAL COVER
WIRE
LEAD
BFORANÉÉÉÉMDE ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉPÉÉÉÉ1 ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
EPOXY
CASE
DIE
ABSOLUTE ELEMENT
BOND
P2
Figure 4. Cross–Sectional Diagrams (Not to Scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2100 series pressure sensor operating charac-
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor perfor-
mance and long term reliability. Contact the factory for in-
formation regarding media compatibility in your application.
Motorola Sensor Device Data For More Information On This Product,
3
Go to: www.freescale.com
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