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MAX9737 Просмотр технического описания (PDF) - Maxim Integrated

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MAX9737
MaximIC
Maxim Integrated MaximIC
MAX9737 Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Mono 7W Class D Amplifier
8V TO 28V
Typical Application Circuit
REG 12
1μF
CREG
RIN
20kΩ
RFB
20kΩ
PRE 8
IN 7
CCOM
1μF
COM 9
CIN
0.47μF
PC 6
AUDIO
INPUT
SHDN
LOGIC INPUT
1μF
1μF
VS
13, 14
PVDD
1, 17, 18
REGULATOR
1μF
100μF
C1
0.1μF
C1P
C1N
16
15
CHARGE
PUMP
C2
1μF
2 CHOLD
POWER
STAGE
23, 24 OUT+
19, 20 OUT-
BIAS
PRECHARGE
CONTROL
5
SHDN
4
MUTE
VS
MAX9737
3, 10, 11
21, 22
AGND
PGND
Supply Bypassing, Layout, and Grounding
Proper layout and grounding are essential for optimum
performance. Use wide traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance. Proper grounding improves
audio performance, minimizes crosstalk between chan-
nels, and prevents switching noise from coupling into
the audio signal. Connect PGND and AGND together at
a single point on the PCB. Route all traces that carry
switching transients away from AGND and the
traces/components in the audio signal path.
Bypass PVDD with two 1µF capacitors to PGND. Place
the bypass capacitors as close as possible to the
MAX9737. Place a 100µF capacitor between PVDD and
PGND. Bypass VS, VCOM, and VREG with a 1µF capacitor
to AGND.
Use wide, low-resistance output traces. Current drawn
from the outputs increases as load impedance
decreases. High-output trace resistance decreases the
power delivered to the load. The MAX9737 TQFN pack-
age features an exposed thermal pad on its underside.
This pad lowers the package’s thermal resistance by
providing a heat conduction path from the die to the
PCB. Connect the exposed thermal pad to PGND by
using a large pad and multiple vias to the PGND plane.
10 ______________________________________________________________________________________

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