MAX8550(2004) Просмотр технического описания (PDF) - Maxim Integrated
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MAX8550
(Rev.:2004)
(Rev.:2004)
Maxim Integrated
MAX8550 Datasheet PDF : 29 Pages
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Integrated DDR Power-Supply Solutions for
Desktops, Notebooks, and Graphic Cards
ABSOLUTE MAXIMUM RATINGS
VIN to GND .............................................................-0.3V to +30V
VDD, AVDD , VTTI to GND .........................................-0.3V to +6V
SHDNA, SHDNB, REFIN to GND..............................-0.3V to +6V
SS, POK1, POK2, SKIP, ILIM, FB to GND ................-0.3V to +6V
STBY, TON, REF, UVP/OVP to GND ........-0.3V to (AVDD + 0.3V)
OUT, VTTR to GND ..................................-0.3V to (AVDD + 0.3V)
DL to PGND1..............................................-0.3V to (VDD + 0.3V)
DH to LX ....................................................-0.3V to (VBST + 0.3V)
LX to BST..................................................................-6V to +0.3V
LX to GND .................................................................-2V to +30V
VTT to GND...............................................-0.3V to (VVTTI + 0.3V)
VTTS to GND............................................-0.3V to (AVDD + 0.3V)
PGND1, PGND2 to GND .......................................-0.3V to +0.3V
REF Short Circuit to GND ...........................................Continuous
Continuous Power Dissipation (TA = +70°C)
28-Pin 5mm x 5mm TQFN (derate 35.7mW/°C
above +70°C).................................................................2.86W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +165°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = +15V, VDD = AVDD = VSHDNA = VSHDNB = VBST = VILIM = 5V, VOUT = VREFIN = VVTTI = 2.5V, UVP/OVP = STBY = FB = SKIP
= GND, PGND1 = PGND2 = LX = GND, TON = OPEN, VVTTS = VVTT, TA = -40°C to +85°C, unless otherwise noted. Typical values
are at TA = +25°C.) (Note 1)
PARAMETER
MAIN PWM CONTROLLER
Input Voltage Range
Output Adjust Range
Output Voltage Accuracy
(Note 2)
Soft-Start Ramp Time
On-Time
Minimum Off-Time
VIN Quiescent Supply Current
VIN Shutdown Supply Current
AVDD Quiescent Supply Current
AVDD + VDD Shutdown Supply
Current
AVDD Undervoltage-Lockout
Threshold
VDD Quiescent Supply Current
SYMBOL
CONDITIONS
VIN
VDD, AVDD
VOUT
FB = OUT
FB = GND
FB = VDD
tSS
Rising edge of SHDNA to full current limit
VIN = 15V,
tON
VOUT = 1.5V
(Note 3)
TON = GND (600kHz)
TON = REF (450kHz)
TON = OPEN (300kHz)
TON = AVDD (200kHz)
tOFF_MIN (Note 3)
IIN
SHDNA = SHDNB = GND
IAVDD
All on (PWM, VTT, and VTTR on)
SHDNA = GND (only VTT and VTTR on)
STBY = AVDD (only VTTR and PWM on)
SHDNB = GND (only PWM on)
SHDNA = SHDNB = GND
IVDD
Rising edge of VIN
Hysteresis
Set VFB = 0.8V
MIN
2
4.5
0.7
0.693
2.47
1.78
170
213
316
461
200
4.1
TYP
0.7
2.5
1.8
1.7
194
243
352
516
300
25
1
2.5
2
1
0.5
2
4.25
50
1
MAX UNITS
28
V
5.5
5.5
V
0.707
2.53
V
1.82
ms
219
273
ns
389
571
450
ns
40
µA
5
µA
5
4
mA
2
1
10
µA
4.4
V
mV
5
µA
2 _______________________________________________________________________________________
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