MAS9283 Просмотр технического описания (PDF) - Micro Analog systems

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MAS9283

IC FOR 18.00 - 40.00 MHz VCTCXO

Micro Analog systems 

SOLDERING INFORMATION

N For Eutectic Sn/Pb

Maximum Reflow Temperature

Maximum Number of Reflow Cycles

Reflow profile

Seating Plane Co-planarity

Lead Finish

Moisture Sensitivity Level (MSL)

N For Pb-Free

Maximum Temperature

Maximum Number of Reflow Cycles

Reflow profile

Seating Plane Co-planarity

Lead Finish

Moisture Sensitivity Level (MSL)

DA9283.006

13 July 2006

240°C

2

Thermal profile parameters stated in JESD22-A113 should not

be exceeded. http://www.jedec.org

max 0.08 mm

Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%

1

260°C

3

Thermal profile parameters stated in JESD22-A113 should not

be exceeded. http://www.jedec.org

max 0.08 mm

Solder plate 7.62 - 25.4 µm, material Matte Tin

1

10 (14)

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