M541 Просмотр технического описания (PDF) - M/A-COM Technology Solutions, Inc.

Номер в каталоге

Компоненты Описание

Список матч

M541

Bonding, Handling, and Mounting Procedures for Chip Diode Devices

M/A-COM Technology Solutions, Inc. 

Application Note

M541

Bonding, Handling, and Mounting Procedures for

Chip Diode Devices

M/A-COM Products

Rev. V3

Acceptable Bonds

Wire or strap does not separate when tested.

No fractures in bond.

No separation of metallization.

Wire breaks before bonds

Bad Bonds

Wire separates from bond.

Bond fractures at weld

Separation of metallization

Bonding to Small Mesas

When bonding to a small mesa type diode, it is sug-

gested to always use a strap. The strap, in many cases,

may be larger than the top of the mesa (the larger the

cross section area of the strap, the lower the parasitic

inductance). In the case, it is advisable to bond all or as

much to the entire top of the mesa as possible.

Good Bonding Criteria

Bond Strength Pull Test

It is extremely important to maintain good quality control

procedures in order to ensure good bonding. The follow-

ing figures and tables illustrate criteria for visual inspec-

tion and for testing of bond strength.

When testing a mesa diode, if the bond is good, the

mesa will usually break off before the bond or strap

breaks. For all other bonds, the bonds should be as

strong as the wire or strap when tested by pulling. Im-

proper top bonding usually results in one of the following

problems:

Cracking or stressing the die through excessive pres-

sure.

Weak bonds from inadequate cleanliness or improper

bonding conditions.

Excessive parasitic capacitance from overlapping wire or

strap.

7

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

Commitment to produce in volume is not guaranteed.

changes to the product(s) or information contained herein without notice.

Share Link: