LX5512E(2004) Просмотр технического описания (PDF) - Microsemi Corporation
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LX5512E Datasheet PDF : 10 Pages
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LX5512E
TM
®
InGaP HBT 2.4 – 2.5 GHz Power Amplifier
PRODUCTION DATA SHEET
PACKAGE DIMENSIONS
LQ 16-Pin MLPQ 3x3 (67x67 mil DAP)
D
E
A1
A3
b
D2
K
E2
L
e
A
MILLIMETERS
INCHES
Dim MIN MAX MIN MAX
A 0.80 1.00 0.031 0.039
A1
0
0.05
0 0.002
A3
0.20 REF
0.008 REF
b 0.18 0.30 0.007 0.012
D
3.00 BSC
0.118 BSC
E
3.00 BSC
0.118 BSC
e
0.50 BSC
0.020 BSC
D2 1.30 1.55 0.051 0.061
E2 1.30 1.55 0.051 0.061
K
0.2
-
0.008
-
L 0.35 0.50 0.012 0.020
Note:
1. Dimensions do not include mold flash or protrusions;
these shall not exceed 0.155mm(.006”) on any side.
Lead dimension shall not include solder coverage.
Copyright 2000
Rev. 1.2, 2004-01-16
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 10
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