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LX5512E(2004) Просмотр технического описания (PDF) - Microsemi Corporation

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LX5512E
(Rev.:2004)
Microsemi
Microsemi Corporation Microsemi
LX5512E Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
LX5512E
TM
®
InGaP HBT 2.4 – 2.5 GHz Power Amplifier
PRODUCTION DATA SHEET
DESCRIPTION
The LX5512E is a power amplifier For 19dBm OFDM output power
optimized for WLAN applications in (64QAM, 54Mbps), the PA provides a
the 2.4-2.5 GHz frequency range. The low EVM (Error-Vector Magnitude) of
PA is implemented as a three-stage 3 %, and consumes 130 mA total DC
monolithic microwave integrated current.
circuit (MMIC) with active bias and The LX5512E is available in a 16-pin
input/output pre-matching. The device 3mmx3mm micro-lead package (MLP).
is manufactured with an InGaP/GaAs The compact footprint, low profile, and
Heterojunction Bipolar Transistor excellent thermal capability of the MLP
(HBT) IC process (MOCVD). It package makes the LX5512E an ideal
operates at a single low voltage supply solution for high-gain power amplifier
of 3.3V with 34 dB power gain requirements for IEEE 802.11b/g
between 2.4-2.5GHz, at a low applications.
quiescent current of 50 mA.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
KEY FEATURES
ƒ Advanced InGaP HBT
ƒ 2.4 – 2.5GHz Operation
ƒ Single-Polarity 3.3V Supply
ƒ Low Quiescent Current Icq
~50mA
ƒ Power Gain ~34dB @ 2.45GHz
and Pout = 19dBm
ƒ Total Current 130mA for Pout =
19dBm @ 2.45GHz OFDM
ƒ EVM ~ 3.0% for 64QAM /
54Mbps and Pout = 19dBm
ƒ Small Footprint (3 x 3 mm2)
ƒ Low Profile (0.9mm)
APPLICATIONS
ƒ IEEE 802.11b/g
PRODUCT HIGHLIGHT
Copyright 2000
Rev. 1.2, 2004-01-16
PACKAGE ORDER INFO
Plastic MLPQ
LQ 16 pin
LX5512E-LQ
Note: Available in Tape & Reel.
Append the letter “T” to the part number.
(i.e. LX5512E-LQT)
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1

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