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LAN91C96 Просмотр технического описания (PDF) - SMSC -> Microchip

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LAN91C96 Datasheet PDF : 125 Pages
First Prev 121 122 123 124 125
Non-PCI Single-Chip Full Duplex Ethernet Controller with Magic Packet
Figure 12.29 - 100 PIN TQFP Package
MIN
NOMINAL
MAX
REMARKS
A
~
~
1.20
Overall Package Height
A1
0.05
~
0.15
Standoff
A2
0.95
~
1.05
Body Thickness
D
15.80
~
16.20
X Span
D1
13.90
~
14.10
X body Size
E
15.80
~
16.20
Y Span
E1
13.90
~
14.10
Y body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length
L1
~
1.00
~
Lead Length
e
0.50 Basic
θ
0o
~
7o
W
0.17
0.22
0.27
Lead Pitch
Lead Foot Angle
Lead Width
R1
0.08
~
~
Lead Shoulder Radius
R2
0.08
~
0.20
Lead Foot Radius
ccc
~
~
0.08
Coplanarity
Notes:
1 Controlling Unit: millimeter.
2 Tolerance on the true position of the leads is ± 0.04 mm maximum.
3 Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5 Details of pin 1 identifier are optional but must be located within the zone indicated.
Rev. 09/10/2004
Page 124
DATASHEET
SMSC LAN91C965v&3v

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