IRF6678TR1 Просмотр технического описания (PDF) - International Rectifier

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IRF6678TR1

DirectFET Power MOSFET

International Rectifier 

IRF6678

Absolute Maximum Ratings

Parameter

PD @TA = 25°C

PD @TA = 70°C

PD @TC = 25°C

TP

TJ

TSTG

Power Dissipation

Power Dissipation

Power Dissipation

Peak Soldering Temperature

Operating Junction and

Storage Temperature Range

Thermal Resistance

Parameter

RθJA

RθJA

RθJA

RθJC

RθJ-PCB

Junction-to-Ambient

Junction-to-Ambient

Junction-to-Ambient

Junction-to-Case

Junction-to-PCB Mounted

Linear Derating Factor

Max.

2.8

1.8

89

270

-40 to + 150

Typ.

–––

12.5

20

–––

1.0

0.022

Max.

45

–––

–––

1.4

–––

Units

W

°C

Units

°C/W

W/°C

100

D = 0.50

10

0.20

0.10

0.05

1

0.02

0.01

0.1

0.01

0.001

1E-006

1E-005

τJ τJ

τ1 τ1

R1R1

R2R2

τ2 τ2

R3R3

τ3 τ3

R4R4

τCτ

Ri (°C/W)

0.6784

17.299

τi (sec)

0.00086

0.57756

τ4 τ4

17.566 8.94000

SINGLE PULSE

Ci= τi/Ri

Ci i/Ri

( THERMAL RESPONSE )

9.4701 106

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthja + Tc

0.0001

0.001

0.01

0.1

1

10

100

t1 , Rectangular Pulse Duration (sec)

Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient

Notes:

Surface mounted on 1 in. square Cu board, steady state.

Used double sided cooling , mounting pad.

Mounted on minimum footprint full size board with metalized

back and with small clip heatsink.

TC measured with thermocouple incontact with top (Drain) of part.

Rθ is measured at TJ of approximately 90°C.

Surface mounted on 1 in. square Cu

board (still air).

www.irf.com

Mounted to a PCB with a

thin gap filler and heat sink.

(still air)

Mounted on minimum

footprint full size board with

metalized back and with small

clip heatsink (still air)

3

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