IRF6622TR1 Просмотр технического описания (PDF) - International Rectifier
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IRF6622TR1 Datasheet PDF : 10 Pages
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Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
TP
TJ
TSTG
Power Dissipation
Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJC
RθJ-PCB
Parameter
g Junction-to-Ambient
dg Junction-to-Ambient
eg Junction-to-Ambient
fg Junction-to-Case
Junction-to-PCB Mounted
à Linear Derating Factor
IRF6622
Max.
2.2
1.4
34
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
0.017
Max.
58
–––
–––
3.7
–––
Units
W
°C
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
Ri (°C/W) τi (sec)
R1R1
R2R2
R3R3
R4R4
R5R5
1.620 0.000126
τJ τJ
τ1 τ1
τAτA 2.141 0.001354
τ2 τ2
τ3 τ3
τ4 τ4
τ5 τ5
22.289 0.375850
Ci= τi/Ri
Ci= τi/Ri
0.1
SINGLE PULSE
( THERMAL RESPONSE )
20.046 7.41
11.914 99
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.01
1E-006 1E-005 0.0001
0.001
0.01
0.1
1
10
100
1000
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Notes:
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
TC measured with thermocouple incontact with top (Drain) of part.
Rθ is measured at TJ of approximately 90°C.
Surface mounted on 1 in. square Cu (still Mounted to a PCB with
air).
small clip heatsink (still air)
www.irf.com
Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
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