HMC797 Просмотр технического описания (PDF) - Hittite Microwave

Номер в каталоге

Компоненты Описание

Список матч

HMC797

GaAs PHEMT MMIC 1 WATT POWER AMPLIFIER, DC - 22 GHz

Hittite Microwave 

Outline Drawing

v02.1011

HMC797

GaAs PHEMT MMIC

1 WATT POWER AMPLIFIER, DC - 22 GHz

3

This die utilizes fragile air bridges. Any pick-up tools used must not contact the die in the cross hatched area.

Die Packaging Information [1]

Standard

Alternate

WP-19 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section on our

website for die packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND PAD IS .004” SQUARE

4. BOND PAD METALIZATION: GOLD

5. BACKSIDE METALIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS

8. OVERALL DIE SIZE ±.002”

For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

3-6

Share Link: