HEF4516B Просмотр технического описания (PDF) - NXP Semiconductors.

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HEF4516B

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NXP Semiconductors. 

NXP Semiconductors

SO16: plastic small outline package; 16 leads; body width 3.9 mm

HEF4516B

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SOT109-1

D

y

Z

16

pin 1 index

1

e

E

A

X

c

HE

vM A

9

A2

A1

8

bp

wM

Q

(A 3)

A

Lp

L

detail X

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT max. A1

A2

A3

bp

c

D (1) E (1)

e

HE

L

Lp

Q

v

w

y

Z (1)

mm

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

10.0

9.8

4.0

3.8

1.27

6.2

5.8

1.05

1.0

0.4

0.7

0.6

0.25 0.25

0.1

0.7

0.3

8o

inches

0.069

0.010

0.004

0.057

0.049

0.01

0.019 0.0100 0.39

0.014 0.0075 0.38

0.16

0.15

0.05

0.244

0.228

0.041

0.039

0.016

0.028

0.020

0.01

0.01

0.004

0.028

0.012

0o

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

OUTLINE

VERSION

SOT109-1

IEC

076E07

REFERENCES

JEDEC

JEITA

MS-012

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-19

Fig 10. Package outline SOT109-1 (SO16)

HEF4516B_6

Product data sheet

Rev. 06 — 11 December 2009

© NXP B.V. 2009. All rights reserved.

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