FAN7313 Просмотр технического описания (PDF) - Fairchild Semiconductor
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FAN7313 Datasheet PDF : 11 Pages
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Package Dimensions
20-SOIC
Dimensions are in millimeters unless otherwise noted.
Symbol
A
A1
B
C
D
E
e
H
h
L
N
α
ccc
Inches
Min. Max.
.093 .104
.004 .012
.013 .020
.009 .013
.496 .512
.291 .299
.050 BSC
.394 .419
.010 .029
.016 .050
20
0°
8°
.004
Millimeters
Min. Max.
2.35 2.65
0.10 0.30
0.33 0.51
0.23 0.32
12.60 13.00
7.40 7.60
1.27 BSC
10.00 10.65
0.25 0.75
0.40 1.27
20
0°
8°
0.10
Notes
5
2
2
3
6
Notes:
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2. "D" and "E" do not include mold flash. Mold flash or
protrusions shall not exceed .010 inch (0.25mm).
3. "L" is the length of terminal for soldering to a substrate.
4. Terminal numbers are shown for reference only.
5. "C" dimension does not include solder finish thickness.
6. Symbol "N" is the maximum number of terminals.
20
11
EH
1
A
e
10
D
A1
B
SEATING – C –
α
PLANE LEAD COPLANARITY
ccc C
h x 45°
C
L
January 2001, Rev. A
© 2006 Fairchild Semiconductor Corporation
FAN7313 Rev. 1.0.0
10
www.fairchildsemi.com
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