DIM200PHM33-F000 Просмотр технического описания (PDF) - Dynex Semiconductor

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DIM200PHM33-F000

Half Bridge IGBT Module

Dynex Semiconductor 

DIM200PHM33-F000

PACKAGE DETAILS

For further package information, please visit our website or contact Customer Services.

All dimensions in mm, unless stated otherwise.

DO NOT SCALE.

Nominal Weight: 750g

Module Outline Type Code: P

Fig. 11 Module outline drawing

Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures

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www.dynexsemi.com

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