DG3000 Просмотр технического описания (PDF) - Vishay Semiconductors
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DG3000 Datasheet PDF : 14 Pages
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Product is End of Life
PACKAGE OUTLINE
MICRO FOOT: 6-BUMP (3 x 2, 0.5 mm PITCH)
DG3000
Vishay Siliconix
6 x Ø 0.150 ∼ 0.229
Note b
Solder Mask Ø ∼ Pad Dia. + 0.1
0.5
0.5
Recommended Land Pattern
A
A2
A1
Index-Bump A1
Note c
XXX
3000
Top Side (Die Back)
b Diameter
e
S
3
2
S
e
D
Silicon
Bump
Note a
1
A
E
B
Notes (Unless Otherwise Specified):
a. Bump is Eutectic 63/57 Sn/Pb or Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.
EUTECTIC (Sn/Pb)
Millimetersa
Inches
Dim.
Min.
Max.
Min.
Max.
A
0.615
0.715
0.0242
0.0281
A1
0.140
0.190
0.0055
0.0075
A2
0.470
0.495
0.0185
0.0195
b
0.180
0.250
0.0071
0.0098
D
1.555
1.585
0.0612
0.0624
E
1.055
1.085
0.0415
0.0427
e
0.5 BASIC
0.0197 BASIC
S
0.278
0.293
0.0109
0.0115
Notes:
a. Use millimeters as the primary measurement.
LEAD (Pb)-FREE (Sn/Ag/Cu)
Millimetersa
Inches
Dim.
Min.
Max.
Min.
Max.
A
0.688
0.753
0.0271
0.0296
A1
0.218
0.258
0.0086
0.0102
A2
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.555
1.585
0.0612
0.0624
E
1.055
1.085
0.0415
0.0427
e
0.5 BASIC
0.0197 BASIC
S
0.278
0.293
0.0109
0.0115
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71742.
Document Number: 71742
www.vishay.com
S-70853–Rev. F, 30-Apr-07
9
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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