DG3000 Просмотр технического описания (PDF) - Vishay Semiconductors

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DG3000

Low-Voltage Single SPDT MICRO FOOT®Analog Switch

Vishay Semiconductors 

Package Information

Vishay Siliconix

MICRO FOOT: 6-BUMP (3 mm x 2 mm, 0.5 mm PITCH, 165 μm BUMP HEIGHT)

6 x Ø 0.150 ~ 0.229

Note b

Solder Mask Ø ~ Pad Dia. + 0.1

0.5

0.5

Recommended Land Pattern

A

A2

A1

Index-Bump A1

Note c

b Diameter

3

2

1

XXX

3003

Top Side (Die Back)

e

S

S

Notes

(unless otherwise specified)

a. Bump is Eutectic 63/57 Sn/Pb or lead (Pb)-free Sn/Ag/Cu.

b. Non-solder mask defined copper landing pad.

c. Laser mark on silicon die back; no coating. Shown is not actual marking; sample only.

e

D

Silicon

Bump

Note a

A

E

B

EUTECTIC (Sn/Pb)

DIM.

A

A1

A2

b

D

E

e

S

MILLIMETERSa

MIN.

MAX.

0.610

0.685

0.140

0.190

0.470

0.495

0.180

0.250

1.490

1.515

0.990

1.015

0.5 BASIC

0.245

0.258

INCHES

MIN.

MAX.

0.0240

0.0270

0.0055

0.0075

0.0185

0.0195

0.0071

0.0098

0.0587

0.0596

0.0390

0.0400

0.0197 BASIC

0.0096

0.0101

Note

a. Use millimeters as the primary measurement.

LEAD (Pb)-FREE (Sn/Ag/Cu)

DIM.

A

A1

A2

b

D

E

e

S

MILLIMETERSa

MIN.

MAX.

0.688

0.753

0.218

0.258

0.470

0.495

0.306

0.346

1.490

1.515

0.990

1.015

0.5 BASIC

0.245

0.258

INCHES

MIN.

MAX.

0.0271

0.0296

0.0086

0.0102

0.0185

0.0195

0.0120

0.0136

0.0587

0.0596

0.0390

0.0400

0.0197 BASIC

0.0096

0.0101

Note

a. Use millimeters as the primary measurement.

ECN: S11-1065-Rev. A, 13-Jun-11

DWG: 6003

Document Number: 63270

Revision: 13-Jun-11

www.vishay.com

1

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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