CS8126 Просмотр технического описания (PDF) - Cherry semiconductor
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CS8126 Datasheet PDF : 9 Pages
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Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
Lead Count
16 Lead SO Wide
D
Metric
English
Max Min Max Min
10.50 10.10 .413 .398
PACKAGE THERMAL DATA
5 Lead 7 Lead 16 Lead
Thermal Data TO-220 D2PAK SOIC Wide
RQJC
typ
2.1
RQJA
typ
50
2.1
10-50*
23
ûC/W
105
ûC/W
*Depending on thermal properties of substrate. RQJA = RQJC + RQCA.
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
2.49 (.098)
2.24 (.088)
1.27 (.050) 0.32 (.013)
0.40 (.016) 0.23 (.009)
D
REF: JEDEC MS-013
1.27 (.050) BSC
2.65 (.104)
2.35 (.093)
0.30 (.012)
0.10 (.004)
2.87 (.113)
2.62 (.103)
6.55 (.258)
5.94 (.234)
5 Lead TO-220 (THA) Horizontal
10.54 (.415)
9.78 (.385)
3.96 (.156)
3.71 (.146)
1.40 (.055)
1.14 (.045)
14.99 (.590)
14.22 (.560)
4.83 (.190)
4.06 (.160)
6.83 (.269)
2.77 (.109)
0.81(.032)
1.68
(.066)
TYP
1.70 (.067)
0.56 (.022)
0.36 (.014)
6.81(.268)
6.60 (.260)
5.84 (.230)
2.92 (.115)
2.29 (.090)
5 Lead TO-220 (T) Straight
2.87 (.113)
6.55 (.258) 2.62 (.103)
5.94 (.234)
10.54 (.415)
9.78 (.385)
3.96 (.156)
3.71 (.146)
4.83 (.190)
4.06 (.160)
1.40 (.055)
1.14 (.045)
14.99 (.590)
14.22 (.560)
14.22 (.560)
13.72 (.540)
1.02 (.040)
0.76 (.030)
1.02(.040)
0.63(.025)
6.93(.273)
6.68(.263)
1.83(.072)
1.57(.062)
0.56 (.022)
0.36 (.014)
2.92 (.115)
2.29 (.090)
6.55 (.258)
5.94 (.234)
5 Lead TO-220 (TVA) Vertical
4.83 (.190)
4.06 (.160)
10.54 (.415)
9.78 (.385)
3.96 (.156)
3.71 (.146)
1.40 (.055)
1.14 (.045)
2.87 (.113)
2.62 (.103)
14.99 (.590)
14.22 (.560)
1.78 (.070)
8.64 (.340)
7.87 (.310)
1.70 (.067)
.94 (.037)
.69 (.027)
6.80 (.268)
1.68
(.066) typ
0.56 (.022)
0.36 (.014)
2.92 (.115)
2.29 (.090)
4.34 (.171)
7.51 (.296)
8
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