BD3951F
Technical Note
●Thermal Design
1000
800
687
600
Glass Epoxy Board (70mm×70mm×1.6mm)
Mount Condition Θj-a=181.8 (℃/W)
400
200
0
0
25
50
75
100 125 150
Ta
[ ℃]
Fig.17
Please consider about power dissipation de-rating curve for high temperature operations. IC characteristics receive great
effect from operating ambient temperature. If junction temperature exceeds rating temperature (Tjmax), device might
degrade or be demolished permanently. Heat design should take consideration from both instant demolish and long life
reliability.To prevent thermal destroy, IC must be operated under the condition that junction temperature is less than Tjmax.
SOP8 package power dissipation temperature de-rating curve is shown in Fig. 17. Operating condition must be less than
power dissipation curve. Calculation formula is as below.
Pc=(Vcc-VOUT)×IOUT+Vcc×Icc
Power Dissipation Pd ≤ Pc
Derive IOUT as operation is less than power dissipation curve,
IOUT ≤
Pd-Vcc×Icc
Vcc-VOUT
(Icc is shown in Fig. 1)
IOUT max is defined by Vcc and VOUT.
Vcc
:
VOUT :
IOUT :
Icc
:
Input Voltage
Output Voltage
Output Current
Circuit Current
·Example
Ta=85℃, Vcc=13.5V and VOUT=5V
IOUT ≤
0.357-13.5×Icc
13.5-5
IOUT≤41.8mA (Icc=135μA)
θja=181.8℃/W→-5.5mW/℃
25℃=687mW→85℃=357mW
Power consumption (Pc) has to be less than power dissipation curve along with the temperature.
The equation under short circuit condition (VOUT-GND short) is as below.
Pc=Vcc×(Icc+Ishort) Ishort=Short Current
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2009.07 - Rev.A