ADM4850 Просмотр технического описания (PDF) - Analog Devices

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ADM4850

5 V, Slew-Rate Limited, Half-Duplex and Full-Duplex RS-485/RS-422 Transceivers

Analog Devices 

ADM4850/ADM4851/ADM4852/ADM4853/ADM4854/ADM4855/ADM4856/ADM4857

OUTLINE DIMENSIONS

5.00 (0.1968)

4.80 (0.1890)

8

4.00 (0.1574)

3.80 (0.1497) 1

5

6.20 (0.2441)

4 5.80 (0.2284)

0.25 (0.0098)

0.10 (0.0040)

1.27 (0.0500)

BSC

1.75 (0.0688)

1.35 (0.0532)

COPLANARITY

0.10

SEATING

PLANE

0.51 (0.0201)

0.31 (0.0122)

0.50 (0.0196) 45°

0.25 (0.0099)

8°

0°

1.27 (0.0500)

0.25 (0.0098) 0.40 (0.0157)

0.17 (0.0067)

COMPLIANT TO JEDEC STANDARDS MS-012-AA

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

Figure 30. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters and (inches)

3.20

3.00

2.80

3.20

3.00

2.80

8

5

5.15

4.90

4.65

1

4

PIN 1

IDENTIFIER

0.65 BSC

0.95

15° MAX

0.85

1.10 MAX

0.75

0.15

0.05

0.40

COPLANARITY

0.25

6°

0.23

0°

0.09

0.80

0.55

0.40

0.10

COMPLIANT TO JEDEC STANDARDS MO-187-AA

Figure 31. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

PIN 1

INDICATOR

3.25

3.00 SQ

2.75

TOP

VIEW

0.60 MAX

0.60 MAX

0.50

BSC

2.95

2.75 SQ

2.55

5

8

EXPOSED

PAD

(BOTTOM VIEW)

1.60

1.45

1.30

12° MAX

0.90 MAX

0.85 NOM

SEATING

PLANE

0.70 MAX

0.65 TYP

0.30

0.23

0.18

0.50

0.40

0.30

0.05 MAX

0.01 NOM

0.20 REF

4

1

PIN 1

1.89 INDICATOR

1.74

1.59

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 32. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

3 mm × 3 mm Body, Very Thin, Dual Lead

(CP-8-2)

Dimensions shown in millimeters

Rev. D | Page 15 of 16

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