AD7781CRZ-REEL Просмотр технического описания (PDF) - Analog Devices
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AD7781CRZ-REEL Datasheet PDF : 16 Pages
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AD7781
OUTLINE DIMENSIONS
8.75 (0.3445)
8.55 (0.3366)
14
4.00 (0.1575)
3.80 (0.1496) 1
8 6.20 (0.2441)
7 5.80 (0.2283)
0.25 (0.0098)
0.10 (0.0039)
COPLANARITY
0.10
1.27 (0.0500)
BSC
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
8°
0°
SEATING
PLANE
0.25 (0.0098)
0.17 (0.0067)
0.50 (0.0197) 45°
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-012-AB
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 24. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-14)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model
AD7781BRZ1
AD7781BRZ-REEL1
AD7781BRUZ1
AD7781BRUZ-REEL1
AD7781CRZ1
AD7781CRZ-REEL1
AD7781CRUZ1
AD7781CRUZ-REEL1
1 Z = RoHS Compliant Part.
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 25. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Temperature Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
Package Description
14-Lead SOIC_N
14-Lead SOIC_N
16-Lead TSSOP
16-Lead TSSOP
14-Lead SOIC_N
14-Lead SOIC_N
16-Lead TSSOP
16-Lead TSSOP
Package Option
R-14
R-14
RU-16
RU-16
R-14
R-14
RU-16
RU-16
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08162-0-5/09(0)
Rev. 0 | Page 16 of 16
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