AD73322 Просмотр технического описания (PDF) - Analog Devices

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AD73322

Low Cost, Low Power CMOS General-Purpose Dual Analog Front End

Analog Devices 

AD73322

ABSOLUTE MAXIMUM RATINGS*

(TA = +25°C unless otherwise noted)

AVDD, DVDD to GND . . . . . . . . . . . . . . . . . –0.3 V to +7 V

AGND to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V

Digital I/O Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V

Analog I/O Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V

Operating Temperature Range

Industrial (A Version) . . . . . . . . . . . . . . . –40°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Maximum Junction Temperature . . . . . . . . . . . . . . . +150°C

SOIC, θJA Thermal Impedance . . . . . . . . . . . . . . . 71.4°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C

LQFP, θJA Thermal Impedance . . . . . . . . . . . . . . . 53.2°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

ORDERING GUIDE

Model

Temperature

Range

Package

Descriptions

Package

Options

AD73322AR

AD73322AST

EVAL-AD73322EB

EVAL-AD73322EZ

–40°C to +85°C

Wide Body SOIC R-28

–40°C to +85°C

Plastic Thin Quad ST-44A

Flatpack (LQFP)

Evaluation Board1

+EZ-KIT Lite Upgrade2

Evaluation Board1

+EZ-KIT Lite3

NOTES

1The AD73322 evaluation board features a selectable number of codecs in

cascade (from 1 to 4). It can be interfaced to an ADSP-2181 EZ-KIT Lite or to

a Texas Instruments EVM kit.

2The upgrade consists of a connector that is used to connect the EZ-KIT to the

AD73322 evaluation board. This option is intended for owners of the EZ-KIT

Lite.

3The EZ-KIT Lite has been modified to allow it to interface with the AD73322

evaluation board. This option is intended for users who do not already have an

EZ-KIT Lite.

PIN CONFIGURATIONS

28-Lead Wide Body SOIC

(R-28)

44-Lead Plastic Thin Quad Flatpack (LQFP)

(ST-44A)

VINP1 1

28 VFBN2

VFBP1 2

27 VINN2

VINN1 3

26 VFBP2

VFBN1 4

25 VINP2

REFOUT 5

24 VOUTN1

REFCAP

AVDD2

AGND2

6 AD73322 23 VOUTP1

7 TOP VIEW 22 VOUTN2

8 (Not to Scale) 21 VOUTP2

DGND 9

20 AVDD1

DVDD 10

19 AGND1

RESET 11

18 SE

SCLK 12

17 SDI

MCLK 13

16 SDIFS

SDO 14

15 SDOFS

44 43 42 41 40 39 38 37 36 35 34

REFOUT 1

REFCAP 2

AVDD2 3

AVDD2 4

AGND2 5

AGND2 6

AGND2 7

AGND2 8

DGND 9

DGND 10

DVDD 11

PIN 1

IDENTIFIER

AD73322

TOP VIEW

(Not to Scale)

33 NC

32 VOUTN1

31 VOUTP1

30 NC

29 VOUTN2

28 VOUTP2

27 NC

26 AVDD1

25 AVDD1

24 AGND1

23 AGND1

12 13 14 15 16 17 18 19 20 21 22

NC = NO CONNECT

–10–

REV. B

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