74LVC3G34(2007) Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание

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74LVC3G34
(Rev.:2007)

Triple buffer

NXP Semiconductors. 

NXP Semiconductors

74LVC3G34

Triple buffer

3. Ordering information

Table 1. Ordering information

Type number

Package

Temperature range Name Description

Version

74LVC3G34DP

−40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

SOT505-2

74LVC3G34DC

−40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; SOT765-1

body width 2.3 mm

74LVC3G34GT

−40 °C to +125 °C XSON8 plastic extremely thin small outline package; no leads; SOT833-1

8 terminals; body 1 × 1.95 × 0.5 mm

74LVC3G34GM

−40 °C to +125 °C XQFN8 plastic extremely thin quad flat package; no leads;

8 terminals; body 1.6 × 1.6 × 0.5 mm

SOT902-1

4. Marking

Table 2. Marking codes

Type number

74LVC3G34DP

74LVC3G34DC

74LVC3G34GT

74LVC3G34GM

5. Functional diagram

Marking code

V34

Y34

Y34

Y34

1 1A

2 3Y

3 2A

1Y 7

3A 6

2Y 5

001aaa684

Fig 1. Logic symbol

1

1

7

3

1

5

6

1

2

001aaa724

Fig 2. IEC logic symbol

A

Y

001aac536

Fig 3. Logic diagram (one gate)

74LVC3G34_5

Product data sheet

Rev. 05 — 5 October 2007

© NXP B.V. 2007. All rights reserved.

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