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Philips Semiconductors
QIC read-write amplifier
PACKAGE OUTLINE
SO24: plastic small outline package; 24 leads; body width 7.5 mm
Preliminary specification
TZA1000
SOT137-1
D
y
Z
24
c
13
E
A
X
HE
vM A
pin 1 index
1
e
12
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25 0.25
0.1
0.9
0.4
8o
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.050
0.419
0.394
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT137-1
IEC
075E05
REFERENCES
JEDEC
EIAJ
MS-013AD
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
1998 Mar 17
20