datasheetbank_Logo
Технический паспорт Поисковая и бесплатно техническое описание Скачать

STPS2060C Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
Список матч
STPS2060C
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STPS2060C Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
STPS2060C
2
Package information
Package information
Epoxy meets UL94,V0
Table 4. TO-220AB dimensions
Dimensions
Ref.
Millimeters
Inches
H2
Dia
L2
F2
F1
F
G1
G
L5
L6
L9
L4
A
C
A
D
C
E
L7
F
F1
F2
G
D
G1
H2
L2
M
L4
E
L5
L6
L7
L9
M
Diam.
Min. Max.
4.40
4.60
1.23
1.32
2.40
2.72
0.49
0.70
0.61
0.88
1.14
1.70
1.14
1.70
4.95
5.15
2.40
2.70
10
10.40
16.4 typ.
13
14
2.65
2.95
15.25 15.75
6.20
6.60
3.50
3.93
2.6 typ.
3.75
3.85
Min. Max.
0.173 0.181
0.048 0.051
0.094 0.107
0.019 0.027
0.024 0.034
0.044 0.066
0.044 0.066
0.194 0.202
0.094 0.106
0.393 0.409
0.645 typ.
0.511 0.551
0.104 0.116
0.600 0.620
0.244 0.259
0.137 0.154
0.102 typ.
0.147 0.151
Cooling Method: C
Recommended torque value: 0.55 Nm
Maximum torque value: 0.70 Nm
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
5/7

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]