Features
• Thermally and Electrically Enhanced Packaging Compatible with
   Standard SO−8 Package Footprint
• New Package Provides Capability of Inspection and Probe After
   Board Mounting
• Ultra Low RDS(on) (at 4.5 VGS), Low Gate Resistance and Low QG
• Optimized for Low Side Synchronous Applications
• High Speed Switching Capability
• These are Pb−Free Devices

APPLICATIONs
• Notebook Computer Vcore Applications
• Network Applications
• DC−DC Converters