BYX107G Даташит - Philips Electronics
производитель
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Philips Electronics
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DESCRIPTION
Rugged glass package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
The package is designed to be used in an insulating medium such as resin, oil or SF6 gas.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Recovery times ranging from 600 to 50 ns
• Soft-recovery switching characteristics
• Compact construction.
APPLICATIONS
• High-voltage power supply units in, for example, X-ray or radar systems.
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