Features
● Glass passivated chip junction in P600 Package
● Low leakage
● Uni and Bidirectional unit
● Excellent clamping capability
● 30000W Peak power capability at 10 × 1000µs waveform Repetition rate (duty cycle):0.01%
● Fast response time: typically less than 1.0ps from 0 Volts to VBR min
● Typical IR less than 5μA above 12V.
● High Temperature soldering: 260°C/40 seconds at terminals
● Typical maximum temperature coefficient ΔVBR = 0.1% × VBR@25°C× ΔT
● Plastic package has Underwriters Laboratory Flammability 94V-0
● Matte tin lead–free Plated
● Halogen free and RoHS compliant
● Typical failure mode is short from over-specified voltage or current
● Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
● IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)
● ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2)
● EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4)