A8437 Просмотр технического описания (PDF) - Allegro MicroSystems
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A8437 Datasheet PDF : 22 Pages
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A8437
Mobile Phone Xenon Photoflash Capacitor Charger
with IGBT Driver
Typical Reflow Profile per J-STD-020D
JSTD020D-01 Table 5-2 Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Preheat/Soak
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (ts) from (Tsmin to Tsmax)
Ramp-up rate (TL to Tp)
Liquidous temperature (TL)
Time (tL) maintained above TL
Peak package body temperature (Tp)
100 °C
150 °C
60-120 seconds
3 °C/second max.
183 °C
60-150 seconds
For users Tp must not exceed the
Classification temp in Table 4-1.
For suppliers Tp must equal or exceed
the Classification temp in Table 4-1.
150 °C
200 °C
60-120 seconds
3 °C/second max.
217 °C
60-150 seconds
For users Tp must not exceed the
Classification temp in Table 4-2.
For suppliers Tp must equal or exceed
the Classification temp in Table 4-2.
Time (tp)* within 5 °C of the specified
classification temperature (Tc), see
Figure 5-1.
20* seconds
30* seconds
Ramp-down rate (Tp to TL)
Time 25 °C to peak temperature
6 °C/second max.
6 minutes max.
6 °C/second max.
8 minutes max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If
parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ± 2 °C of the live-bug Tp and still
meet the Tc requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures
refer to JEP140 for recommended thermocouple use.
Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly
profiles should be developed based on specific process needs and board designs and should not exceed the parameters in Table 5-2.
For example, if Tc is 260 °C and time tp is 30 seconds, this means the following for the supplier and the user.
For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 seconds.
For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds.
Note 3: All components in the test load shall meet the classification profile requirements.
Note 4: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020,
JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a
higher peak classification temperature is desired.
Copyright ©2006-2010, Allegro MicroSystems, Inc.
The products described here are manufactured under one or more U.S. patents or U.S. patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to per-
mit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use;
nor for any infringement of patents or other rights of third parties which may result from its use.
Allegro MicroSystems, Inc.
21
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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