C0805C390J5RAC Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание

Список матч

C0805C390J5RAC

Heterojunction Bipolar Transistor Technology (InGaP HBT)

NXP Semiconductors. 

1.7

3.48

5.33

1.27

0.58

0.86

0.64

3.86

Recommended Solder Stencil

7.62

0.305 diameter

2.49

1.27

2.54

NOTES:

1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE

USED IN PCB LAYOUT DESIGN.

2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS

POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.

3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN

AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO

THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL

AND RF PERFORMANCE.

4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM

PITCH.

Figure 20. Recommended Mounting Configuration

001N

()

YYWW

Figure 21. Product Marking

RF Device Data

Freescale Semiconductor, Inc.

MMG3001NT1

9

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