HMC158 Просмотр технического описания (PDF) - Hittite Microwave

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HMC158

GaAs MMIC PASSIVE FREQUENCY DOUBLER CHIP, 1.3 - 4.0 GHz INPUT

Hittite Microwave 

Outline Drawing

2

v06.0711

HMC158

GaAs MMIC PASSIVE FREQUENCY

DOUBLER CHIP, 1.3 - 4.0 GHz INPUT

Die Packaging Information [1]

Standard

Alternate [2]

WP-2 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] Reference this suffix only when ordering alternate die

packaging.

NOTES:

1. THREE PADS ON EACH CORNER MUST BE

BONDED TO GROUND (12 TOTAL).

2. ALL DIMENSIONS IN INCHES [MILLIMETERS]

3. ALL TOLERANCES ARE 0.001 [0.025]

4. DIE THICKNESS IS 0.007 [0.178]

5. BOND PADS ARE 0.004 [0.100] SQUARE

6. EQUALLY SPACED AT 0.006 [0.150] CENTERS

7. BACKSIDE METALLIZATION: NONE

8. BOND PAD METALLIZATION: GOLD

Pad Description

Pad Number

Function

1

RFIN

2

RFOUT

Description

Pad is DC coupled

and matched to 50 ohms.

Pad is DC coupled

and matched to 50 ohms.

Interface Schematic

Die Bottom

GND

DC / RF Ground

2-3

For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

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