CY62146V18 MoBL2™
Electrical Characteristics Over the Operating Range
Parameter
Description
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIX
Input Load Current
IOZ
Output Leakage Current
ICC
VCC Operating Supply
Current
ISB1
Automatic CE
Power-Down Current—
CMOS Inputs
ISB2
Automatic CE
Power-Down Current—
CMOS Inputs
Test Conditions
IOH = –0.1 mA
VCC = 1.75V
IOL = 0.1 mA
VCC = 1.75V
VCC = 1.95V
VCC = 1.75V
GND < VI < VCC
GND < VO < VCC, Output Disabled
IOUT = 0 mA,
f = fMAX = 1/tRC,
CMOS Levels
VCC = 1.95V
IOUT = 0 mA, f = 1 MHz,
CMOS Levels
CE > VCC – 0.3V,
VIN > VCC – 0.3V or
VIN < 0.3V, f = fMAX
CE > VCC – 0.3V
VIN > VCC – 0.3V
or VIN < 0.3V, f = 0
VCC = Std.
1.95V
Min.
1.5
1.4
–0.5
–1
–1
CY62146V18
Typ.[2]
Max.
0.2
VCC + 0.3V
0.4
+1
+1
+1
+1
7
15
1
2
100
20
50
Unit
V
V
V
V
µA
µA
mA
mA
µA
µA
Capacitance[3]
Parameter
CIN
COUT
Description
Input Capacitance
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC= VCC(typ.)
Max.
6
8
Unit
pF
pF
Thermal Resistance
Description
Test Conditions
Thermal Resistance
(Junction to Ambient)[3]
Still Air, soldered on a 4.25 x 1.125 inch, 4-layer
printed circuit board
Thermal Resistance
(Junction to Case)[3]
Note:
3. Tested initially and after any design or process changes that may affect these parameters.
Symbol
ΘJA
ΘJC
BGA
55
16
Unit
°C/W
°C/W
3