RMDA1840 Просмотр технического описания (PDF) - Fairchild Semiconductor
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RMDA1840 Datasheet PDF : 7 Pages
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RMDA1840
18-40 GHz Broad Band Driver Amplifier
MMIC
PRODUCT INFORMATION
Figure 4
Recommended
Assembly Diagram
Die-Attach
80Au/20Sn
10,000pF
Vd (Positive)
10,000pF
100pF
100pF
100pF
100pF
5mil Thick
Alumina
50-Ohm
RF
Input
5 mil
Thick
Alumina
50-Ohm
RF
Output
100pF
100pF
100pF
100pF
2 mil Gap
10,000pF Vg (Negative) 10,000pF
L< 0.015”
(4 Places)
Note Use 0.003” by 0.0005” Gold Ribbon for bonding. RF input and output bonds should be less than 0.015” long with stress relief. If output
power level detection is not desired, do not make connection to detector bond pad.
Characteristic performance data and specifications are subject to change without notice.
Revised January 15, 2001
Page 4
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