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AQW216A

Compact DIP8-pin type of 60V to 600V load voltage

Panasonic Corporation 

Reverse voltages at the input (for TSON)

If reverse voltages are present at the input terminals, for example,

connect a schottky barrier diode in reverse parallel across the input

terminals and keep the reverse voltages below the reverse

breakdown voltage. Typical circuit is shown below.

1

4

2

3

Continual DC bias (AQV259 and AQV258)

If a continual DC bias will be applied between the input and output,

the breakdown voltage of the switching element MOSFET on the

output side may degrade. Therefore, be sure to test the product

under actual conditions. Example of circuits that will cause

degradation of breakdown voltage of MOSFET is given below.

1

E

IF 2

3

6

5

IL

4

Load

Cleaning solvents compatibility

Cleaning the solder flux should use the immersion washing with an

organic solvent. If you have to use ultrasonic cleaning, please adopt

the following conditions and check that there are no problems in the

actual usage.

• Frequency: 27 to 29kHz

• Ultrasonic output: No greater than 0.25W/cm2*

• Cleaning time: 30s or less

• Cleanser used: Asahiklin AK-225

• Others: Float PCB and the device in the cleaning solvent to

prevent from contacting the ultrasonic vibrator

* Applies to unit area ultrasonic output for ultrasonic baths

Notes for mounting

1) When different kinds of packages are mounted on PC boad,

temperature rise at soldering lead is highly dependent on

package size. Therefore, please set the lower temperature

soldering condition than the conditions of item “■Soldering”, and

confirm the temperature condition of actual usage before

soldering.

2) When soldering condition exceeds our recommendation, the

PhotoMOS® characteristics may be adversely affected. It may

occur package crack or bonding wire breaking because of

thermal expansion unconformity and resin strength reduction.

Please contact our sales office about the propriety of the

condition.

3) Please confirm the heat stress by using actual board because it

may be changed by board condition or manufacturing process

condition.

4) Solder creepage, wettability, or soldering strength will be affected

by the soldering condition or used soldering type. Please check

them under the actual production condition in detail.

5) Please apply coating when the device returns to a room

temperature.

PhotoMOS® Cautions for Use

Input wiring pattern

1) With AQY* or AQW* series avoid installing the input (LED side)

wiring pattern to the bottom side of the package if you require the

specified I/O isolation voltage (Viso) after mounting the PC board.

Since part of the frame on the output side is exposed, it may

cause fluctuations in the I/O isolation voltage.

Portion of output side frame

(Output terminal side)

Input wiring

pattern (Input terminal side)

May not allow the prescribed I/O withstand

voltage (Viso) to be achieved

* Excluding reinforced insulation products and SSOP, SON, and TSON packages

2) Exposed terminals are electrically connected to internal elements.

Be aware that contact with external circuits may cause

deterioration of insulation between input and output, leading to

destruction of internal elements.

3) If installed in proximity to other device, take care to avoid short

circuits between device, which may occur if exposed frames of

adjacent device come too close.

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Panasonic Corporation 2020

ASCTB65E 202002

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