NCP1615(2013) Просмотр технического описания (PDF) - ON Semiconductor
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NCP1615 Datasheet PDF : 44 Pages
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NCP1615
Table 3. MAXIMUM RATINGS (Notes 3 and 4)
Rating
Pin
Symbol
Value
Unit
High Voltage Start−Up Circuit Input Voltage
High Voltage Feedback Input Voltage
High Voltage Feedback Input Current
Zero Current Detection and Current Sense Input Voltage (Note 5)
Zero Current Detection and Current Sense Input Current
Control Input Voltage (Note 6)
Supply Input Voltage
Fault Input Voltage
PSTimer Input Voltage
Driver Maximum Voltage (Note 7)
Driver Maximum Current
HV
FBHV
FBHV
CS/ZCD
CS/ZCD
Control
VCC
Fault
PSTimer
DRV
DRV
VHV
−0.3 to 700
V
VFBHV
−0.3 to 700
V
IFBHV
0.5
mA
VCS/ZCD −0.3 to VCS/ZCD(MAX)
V
ICS/ZCD
+5
mA
VControl
−0.3 to VControl(MAX)
V
VCC(MAX)
−0.3 to 28
V
VFault
−0.3 to (VCC + 0.6)
V
VPSTimer
−0.3 to (VCC + 0.6)
V
VDRV
−0.3 to VDRV
V
IDRV(SRC)
500
mA
IDRV(SNK)
800
Maximum Input Voltage (Note 8)
Maximum Operating Junction Temperature
Storage Temperature Range
Lead Temperature (Soldering, 10 s)
Moisture Sensitivity Level
Other Pins
VMAX
TJ
TSTG
TL(MAX)
MSL
−0.3 to 7
V
−40 to 150
°C
–60 to 150
°C
300
°C
1
−
Power Dissipation (TA = 70°C, 1 Oz Cu, 0.155 Sq Inch Printed Circuit
Copper Clad)
Plastic Package SOIC−14NB/SOIC−16NB
PD
mW
465
Thermal Resistance, Junction to Ambient 1 Oz Cu Printed Circuit
Copper Clad)
Plastic Package SOIC−14NB/SOIC−16NB
ESD Capability (Note 9)
Human Body Model per JEDEC Standard JESD22−A114E.
Machine Model per JEDEC Standard JESD22−A114E.
Charge Device Model per JEDEC Standard JESD22−C101E.
RqJA
RqJC
172
68
> 2000
> 200
> 500
°C/W
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. All references to Version C include Versions C/C2, unless otherwise noted.
2. All references to Version D include Versions D/D2, unless otherwise noted.
3. This device contains Latch−Up protection and exceeds ± 100 mA per JEDEC Standard JESD78.
4. Low Conductivity Board. As mounted on 80 x 100 x 1.5 mm FR4 substrate with a single layer of 50 mm2 of 2 oz copper traces and heat
spreading area. As specified for a JEDEC51−1 conductivity test PCB. Test conditions were under natural convection of zero air flow.
5. VCS/ZCD(MAX) is the CS/ZCD pin positive clamp voltage.
6. VControl(MAX) is the Control pin positive clamp voltage.
7. When VCC exceeds the driver clamp voltage (VDRV(high)), VDRV is equal to VDRV(high). Otherwise, VDRV is equal to VCC.
8. When the voltage applied to these pins exceeds 5.5 V, they sink a current about equal to (Vpin − 5.5 V) / (4 kW). An applied voltage of 7 V
generates a sink current of approximately 0.375 mA.
9. Pins HV, PFBHV are rated to the maximum voltage of the part, or 700 V.
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