MSK3015 Просмотр технического описания (PDF) - M.S. Kennedy
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MSK3015 Datasheet PDF : 5 Pages
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ABSOLUTE MAXIMUM RATINGS
VDSS
VDGDR
VGS
ID
IDM
RTH-JC
RTH-JC
Drain to Source Voltage ○ ○ ○ ○ 100V MAX
Drain to Gate Voltage
(R =1MΩ) 100V MAX GS
○
○
○
○
○
○
○
○
○
○
○
Gate to Source Voltage
(Continuous)
±20V MAX ○
○
○
○
○
○
○
○
○
○
Continuous Current ○ ○ ○ ○ ○ ○ ○ 23A MAX
Pulsed Current ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 41A MAX
Thermal Resistance
(Junction to Case)@25°C ○ ○ ○ ○ ○ 1.2°C/W
Thermal Resistance
(Junction to Case)@125°C ○ ○ ○ ○ 2.0°C/W
Single Pulse Avalanche Energy ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 830 mJ
TJ Junction Temperature
+150°C MAX
○
○
○
○
○
○
○
○
○
○
○
TST Storage Temperature ○ ○ ○ ○ ○ ○ ○ ○ ○ -55°C to +150°C
TC Case Operating Temperature Range -55°C to +125°C
TLD Lead Temperature Range
(10 Seconds Lead Only)
○
○
○
○
○
○
○
○
○
○
○
○ 200°C MAX
ELECTRICAL SPECIFICATIONS
Parameter
Test Conditions 4
Min.
MSK3015
Typ.
Max.
Units
Drain-Source Breakdown Voltage
VGS=0 ID=0.25mA
100
-
-
V
Drain-Source Leakage Current
VDS=100V VGS=0V
-
-
250
μA
Gate-Source Leakage Current
VGS=±20V VDS=0
-
-
±100
nA
Gate-Source Threshold Voltage
VDS=VGS ID=250μA
2.0
-
4.0
V
Drain-Source On Resistance 2
VGS=10V ID = 23A
-
-
0.09
Ω
Drain-Source On Resistance 3
VGS=10V ID=23A
-
-
0.06
Ω
Forward Transconductance 1
VDS=25V ID=23A
13
-
-
S
Total Gate Charge 1
ID = 23A
-
-
140
nC
Gate-Source Charge 1
VDS=80V
-
-
29
nC
Gate-Drain Charge 1
Turn-On Delay Time 1
VGS = 10V
VDD=50V
-
-
68
nC
-
16
-
nS
Rise Time 1
ID = 23A
-
120
-
nS
Turn-Off Delay Time 1
RG = 6.2Ω
-
60
-
nS
Fall Time 1
RD = 1.2Ω
-
81
-
nS
Input Capacitance 1
Output Capacitance 1
VGS=0V
VDS=25V
-
2800
-
pF
-
1100
-
pF
Reverse Transfer Capacitance 1
f=1MHz
-
280
-
pF
Body Diode
Forward On Voltage 1
IS=23 A VGS=0V
-
2.5
-
V
Reverse Recovery Time 1
IS=23 A di/dt=100A/μS
-
220
330
nS
Reverse Recovery Charge 1
-
1.9
2.9
μC
NOTES:
1 This parameter is guaranteed by design but need not be tested. Typical parameters are representative of actual device performance but are for reference only.
2 Resistance as seen at package pins.
3 Resistance for die only; use for thermal calculations.
4 TA=25°C unless otherwise specified.
2
Rev. B 7/10
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