Package Dimensions
unit : mm
PQFP100 14x20 / QIP100E
CASE 122BV
ISSUE A
LC75055PE
23.2±0.2
20.0±0.1
12
0.65
(0.58)
0.3±0.05
0.13
0.15
0~10°
0.10
SOLDERING FOOTPRINT*
22.30
(Unit: mm)
GENERIC
MARKING DIAGRAM*
XXXXXXXXX
YMDDD
0.65
0.43
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
No.A2168-5/26