HMC571 Просмотр технического описания (PDF) - Micross Components

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HMC571

GaAs MMIC I/Q DOWNCONVERTER

Micross Components 

Outline Drawing

3

v03.0808

HMC571

GaAs MMIC I/Q DOWNCONVERTER

21 - 25 GHz

3 - 142

Die Packaging Information [1]

Standard

Alternate

GP-1 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS 0.004”

3. BOND PAD METALIZATION: GOLD

4. BACKSIDE METALIZATION: GOLD

5. BACKSIDE METAL IS GROUND

6. OVERALL DIE SIZE ±0.002

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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