HMC524 Просмотр технического описания (PDF) - Analog Devices
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HMC524 Datasheet PDF : 6 Pages
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v02.0907
HMC524
GaAs MMIC I/Q MIXER
22 - 32 GHz
Absolute Maximum Ratings
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 9.8 mW/°C above 85°C)
Thermal Resistance (R )
TH
(junction to die bottom)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
+13 dBm
+27 dBm
150°C
641 mW
102 °C/W
-65 to +150 °C
-55 to +85 deg °C
Class 1A
MxN Spurious Outputs
nLO
mRF
0
1
2
3
4
0
xx
-13
27
xx
xx
1
18
0
35
52
xx
2
76
74
87
74
82
3
xx
83
87
77
87
4
xx
xx
82
87
87
RF = 24.5 GHz @ -10 dBm
LO = 24.4 GHz @ 17 dBm
Data taken without IF hybrid
All values in dBc below IF power level
3
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. OVERALL DIE SIZE ±.002”
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