HMC522LC4 Просмотр технического описания (PDF) - Analog Devices

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HMC522LC4

GaAs MMIC I/Q MIXER

Analog Devices 

v03.0514

Outline Drawing

HMC522LC4

GaAs MMIC I/Q MIXER

11 - 16 GHz

NOTES:

1.. PACKAGE BODY MATERIAL: ALUMINA

2.. LEAD AND GROUND PADDLE PLATING: 30 - 80 MICROINCHES

GOLD OVER 50 MICROINCHES MINIMUM NICKLE

3.. DIMENSIONS ARE IN INCHES [MILLIMETERS]

4.. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

5.. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM

6.. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED

TO PCB RF GROUND

Package Information

Part Number

Package Body Material

HMC522LC4

Alumina, White

[1] Max peak reflow temperature of 260 °C

[2] 4-Digit lot number XXXX

Lead Finish

Gold over Nickel

MSL Rating

MSL3 [1]

Package Marking [2]

H522

XXXX

5

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Trademarks and registered trademarks arAe tphepplriocpearttyioofntheSir urespppecotivret:owPnehrso. ne: 978-250-3A3p4p3licaotrionaSpuppsp@orht:iPtthitoen.ec: o1-m800-ANALOG-D

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