HMC521 Просмотр технического описания (PDF) - Analog Devices
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HMC521 Datasheet PDF : 6 Pages
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v01.1007
Harmonics of LO
LO Freq. (GHz)
nLO Spur at RF Port
1
2
3
4
8.5
42
44
44
70
9.5
50
53
59
77
10.5
51
54
63
xx
11.5
47
58
66
xx
12.5
45
59
70
xx
13.5
45
57
xx
xx
LO = + 15 dBm
Values in dBc below input LO level measured at RF Port.
Absolute Maximum Ratings
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 7.07 mW/°C above 85°C)
Thermal Resistance (R )
TH
(junction to die bottom)
Storage Temperature
Operating Temperature
+20 dBm
+ 27 dBm
150°C
460 mW
141.4 °C/W
-65 to +150 °C
-55 to +85 deg °C
Outline Drawing
HMC521
GaAs MMIC I/Q MIXER
8.5 - 13.5 GHz
MxN Spurious Outputs
nLO
mRF
0
1
2
3
4
0
xx
-5
29
23
52
1
27
0
51
59
81
2
92
85
76
82
92
3
92
92
92
92
92
4
92
92
92
92
92
RF = 10.6 GHz @ -10 dBm
LO = 10.5 GHz @ +15 dBm
Data taken without IF hybrid
All values in dBc below IF power level
3
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
8. OVERALL DIE SIZE ±.002”
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