HMC520A(RevA) Просмотр технического описания (PDF) - Analog Devices

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HMC520A
(Rev.:RevA)

6 GHz to 10 GHz, GaAs, MMIC, I/Q Mixer

Analog Devices 

HMC520A

Data Sheet

SOLDERING INFORMATION AND RECOMMENDED

LAND PATTERN

Figure 105 shows the recommended land pattern forthe

HMC520A. The HMC520A is contained in a 24-terminal

ceramic LCC package, which has an exposed ground pad.

This pad is internally connected to the ground of the chip.

To minimize thermal impedance and ensure electrical

performance, solder the pad to the low impedance ground

plane on the PCB. To further reduce thermal impedance, stitch

the ground planes together on all layersunder the padwith vias.

The land pattern on the EV1HMC520ALC4 evaluation board

provides a simulated thermal resistance (θJC) of 225°C/W.

SOLDERMASK

GROUND PAD

.178" SQUARE

.004" MASK/METAL OVERLAP

.010" MIN MASK WIDTH

PIN 1

PAD SIZE

.026" × .010"

.0197"

[0.50]

.116"

MASK

OPENING

.034"

TYPICAL

VIA

SPACING

.010" REF

.030"

MASK OPENING

ᶲ .010"

TYPICAL VIA

.106" SQUARE

GROUND PAD

.098" SQUARE MASK OPENING

.020 × 45" CHAMFER FOR PIN 1

Figure 105. Evaluation Board Land Pattern

Rev. A | Page 30 of 32

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