CMP401GP Просмотр технического описания (PDF) - Analog Devices
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CMP401GP Datasheet PDF : 8 Pages
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CMP401/ CMP402
ABSOLUTE MAXIMUM RATINGS1
Total Analog Supply Voltage . . . . . . . . . . . . . . . . . . . . . +16 V
Digital Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Analog Positive Supply—Digital Positive Supply . . . . –200 mV
Input Voltage2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 7 V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ± 9 V
Output Short-Circuit Duration to GND . . . . . . . . . Indefinite
Storage Temperature Range
P, S, RU Package . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range
CMP401G, CMP402G . . . . . . . . . . . . . . –40°C to +125°C
Junction Temperature Range
P, S, RU Package . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300°C
Package Type
JA3
16-Pin Plastic DIP (P) 90
16-Pin SO (S)
113
16-Lead TSSOP (RU) 180
JC
Units
47
°C/W
37
°C/W
37
°C/W
NOTES
1Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2The analog input voltage is equal to ± 7 volts or the analog supply voltage,
whichever is less.
3θJA is specified for the worst case conditions, i.e., θJA is specified for device in socket
for P-DIP, and θJA is specified for device soldered in circuit board for SOIC and
TSSOP packages.
ORDERING GUIDE
Model
Temperature
Range
Package
Description
Package
Option
CMP401GP
CMP401GS
CMP401GRU
CMP402GP
CMP402GS
CMP402GRU
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
16-Pin Plastic DIP
16-Pin SOIC
16-Lead TSSOP
16-Pin Plastic DIP
16-Pin SOIC
16-Lead TSSOP
N-16
R-16A
RU-16
N-16
R-16A
RU-16
DICE CHARACTERISTICS
21
16 15
3
14
4
13
5
12
6
11
7
10
8
9
CMP401/CMP402 Die Size 0.065 × 0.069 inch, 4,485 sq. mils
Substrate (Die Backside) Is Connected to V+
Transistor Count 104.
V+ ANA
V+ DIG
+IN
–IN
OUT
V– ANA
Figure 1. Simplified Schematic
DIG GND
16-Lead Epoxy DIP
(P Suffix)
CMP401/CMP402 PIN CONFIGURATIONS
16-Lead Narrow-SO
(S Suffix)
OUT B 1
OUT A 2
V+ DIG 3
V+ ANA 4
–IN A 5
+IN A 6
–IN B 7
+IN B 8
16 OUT C
15 OUT D
14 DIG GND
13 V– ANA
12 –IN D
11 +IN D
10 –IN C
9 +IN C
OUT B 1
16 OUT C
OUT A 2
15 OUT D
V+ DIG 3
14 DIG GND
CMP401/
V+ ANA 4
402
13 V– ANA
–IN A
5
TOP VIEW
(Not to Scale)
12 –IN D
+IN A 6
11 +IN D
–IN B 7
10 –IN C
+IN B 8
9 +IN C
16-Lead
TSSOP
(RU Suffix)
1
16
OUT B
OUT C
OUT A
OUT D
V+ DIG
V+ ANA
–IN A
+IN A
–IN B
CMP401/
402
TOP VIEW
(Not to Scale)
DIG GND
V– ANA
–IN D
+IN D
–IN C
+IN B
+IN C
8
9
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the CMP401/CMP402 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
–4–
WARNING!
ESD SENSITIVE DEVICE
REV. 0
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