ISL9016IRUFBZ-T Просмотр технического описания (PDF) - Renesas Electronics

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ISL9016IRUFBZ-T

150mA Dual LDO with Low Noise, High PSRR, and Low IQ

Renesas Electronics 

ISL9016

Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)

A

E

AB

6

4

PIN 1

D

REFERENCE

2X 0.15 C

1

3

2X 0.15 C

TOP VIEW

A1

e

1.00 REF

4

6

L

D2

CO.2

3

E2

DAP SIZE 1.30 x 0.76

1 b 6X

0.10 M C A B

BOTTOM VIEW

0.10 C

DETAIL A

6X 0.08 C

SIDE VIEW

A3 C

SEATING

PLANE

L6.1.6x1.6A

6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE

MILLIMETERS

SYMBOL

MIN

NOMINAL

MAX

NOTES

A

0.45

0.50

0.55

-

A1

-

-

0.05

-

A3

0.127 REF

-

b

0.15

0.20

0.25

-

D

1.55

1.60

1.65

4

D2

0.40

0.45

0.50

-

E

1.55

1.60

1.65

4

E2

0.95

1.00

1.05

-

e

0.50 BSC

-

L

0.25

0.30

0.35

-

NOTES:

Rev. 1 6/06

1. Dimensions are in mm. Angles in degrees.

2. Coplanarity applies to the exposed pad as well as the terminals.

Coplanarity shall not exceed 0.08mm.

3. Warpage shall not exceed 0.10mm.

4. Package length/package width are considered as special

characteristics.

5. JEDEC Reference MO-229.

6. For additional information, to assist with the PCB Land Pattern

Design effort, see Intersil Technical Brief TB389.

0.127±0.008

A1

DETAIL A

0.50

0.25

0.127 +0.058

-0.008

TERMINAL THICKNESS

1.00

1.25

0.45 1.00

0.30

2.00

LAND PATTERN 6

FN6832 Rev 1.00

May 16, 2011

Page 11 of 11

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