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ISL6532B Просмотр технического описания (PDF) - Renesas Electronics

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ISL6532B Datasheet PDF : 15 Pages
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ISL6532B
S3
S5
12VATX 2V/DIV
VDDQ
500mV/DIV
VTT
500mV/DIV
PGOOD
5V/DIV
12V POR
2048 CLOCK
CYCLES
PGOOD COMPARATOR
ENABLED
FIGURE 2. TYPICAL S3 TO S0 STATE TRANSITION
overcurrent event on the VTT LDO, only the VTT LDO is
disabled. Once the over current condition on the VTT rail is
removed, VTT will recover.
Over/Under Voltage Protection.
Both the internal VTT LDO and the VDDQ regulator are
protected from faults through internal Over/Under voltage
detection circuitry. If either rail falls below 85% of the targeted
voltage, then an undervoltage event is tripped. An under voltage
will disable all regulators for a period of 3 soft-start cycles, after
which a normal soft-start is initiated. If the output remains under
85% of target, the regulators will continue to be disabled and
soft-started in a hiccup mode until the fault is cleared. See
Figure 3.
If either rail exceeds 115% of the targeted voltage, then all
outputs are immediately disabled. The ISL6532B will not re-
enable the outputs until either the bias voltage is toggled in
order to initiate a POR or the SLP_S5 signal is forced LOW
and then back to HIGH.
Thermal Protection (S0/S3 State)
If the ISL6532B IC junction temperature reaches a nominal
temperature of 140oC, all regulators will be disabled. The
ISL6532B will not re-enable the outputs until the junction
temperature drops below 110oC and either the bias voltage is
toggled in order to initiate a POR or the SLP_S5 signal is
forced LOW and then back to HIGH.
Shoot-Through Protection
A shoot-through condition occurs when both the upper and
lower MOSFETs are turned on simultaneously, effectively
shorting the input voltage to ground. To protect from a shoot-
through condition, the ISL6532B incorporates specialized
circuitry which insures that complementary MOSFETs are not
ON simultaneously.
VDDQ
VTT
500mV/DIV
INTERNAL DELAY
DELAY INTERVAL
T0
T1
T2
TIME
FIGURE 3. VTT/VDDQ LDO UNDER VOLTAGE PROTECTION
RESPONSES
The adaptive shoot-through protection utilized by the VDDQ
regulator looks at the lower gate drive pin, LGATE, and the
upper gate drive pin, UGATE, to determine whether a
MOSFET is ON or OFF. If the voltage from UGATE or from
LGATE to GND is less than 0.8V, then the respective MOSFET
is defined as being OFF and the other MOSFET is allowed to
be turned ON. This method allows the VDDQ regulator to both
source and sink current.
Since the voltage of the MOSFET gates are being measured to
determine the state of the MOSFET, the designer is
encouraged to consider the repercussions of introducing
external components between the gate drivers and their
respective MOSFET gates before actually implementing such
measures. Doing so may interfere with the shoot-through
protection.
Application Guidelines
Layout Considerations
Layout is very important in high frequency switching converter
design. With power devices switching efficiently at 250kHz, the
resulting current transitions from one device to another cause
voltage spikes across the interconnecting impedances and
parasitic circuit elements. These voltage spikes can degrade
efficiency, radiate noise into the circuit, and lead to device
over-voltage stress. Careful component layout and printed
circuit board design minimizes these voltage spikes.
As an example, consider the turn-off transition of the upper
MOSFET. Prior to turn-off, the MOSFET is carrying the full
load current. During turn-off, current stops flowing in the
MOSFET and is picked up by the lower MOSFET. Any
FN9120 Rev 3.00
Jul 2004
Page 9 of 15

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