MC33288DDH Просмотр технического описания (PDF) - Freescale Semiconductor

Номер в каталоге

Компоненты Описание

Список матч

MC33288DDH

Solid State Relay for Automotive Flasher Applications

Freescale Semiconductor 

FUNCTIONAL DEVICE OPERATION

OPERATIONAL MODES

This paragraph is boilerplate - you may add to it but, can not change wording. You may change numeric values

An external resistor must be connected to the CUR R

terminal and then tied to a microcontroller A/D input for

analog voltage measurement. The CUR R terminal is

internally clamped to protect the MCU A/D input.

Warning Lamp Driver

The warning lamp driver is a 3.2 Ω RDSON maximum

high-side MOSFET to control the 1.2 W dashboard warning

lamp. This output is current limited and thermally

protected-activated only in the warning mode. It is turned on

by activation of both right and left inputs (IN1 and IN2).

Package

The device is assembled into a power surface mount

package. This package offers high thermal performances

and high current capabilities. It offers 10 terminals on each

package sides and an additional terminal which is the

package heat sink , called terminal 21. The heak sink acts as

the MC33288 power VBAT connection.

Soldering Information

This device is packaged in a Surface Mount Power

package indended to be soldered directly on the Printed

Circuit Board.

This device was qualified according to JEDEC standards

JESD22-A113-B and J-STD-020A with the reflow conditions

applicable for packages with thickness above 2.5 mm:

Convection 220°C +5/-0°C

VPR 215-219°C

IR / Convection 220°C +5/-0°C

The maximum peak temperature during the soldering

process should not exceed 220°C (+5°C/-0°C). The time at

maximum temperature should range from 10 to 40s

maximum.

Thermal Management

The junction to case thermal resistance is 2°C/W

maximum. The junction to ambient thermal resistance is

dependent on the mounting technology and the addition of

heat sink. One of the most commonly used mounting

techniques consists of using the printed circuit board and the

copper lines as heat sink.

Down side pcb

8 cm2

Top side pcb

2 cm2

HSOP20

Thermal

via from

top to down

side pcb

external pcb (4x4 cm)

Figure 3. Printed Board Layout Example (not to scale)

Figure 1 shows an example of printed circuit board layout.

It has a total of 10 cm2 additional copper on two sides (2.5

cm2 on the top side and 7.5 cm2 on the down side).

With the above layout, thermal resistance junction to

ambient of 25°C/W can be achieved, this value being split

into:

• junction to case : RθJC1 = RθJC2 = 2°C/W

• case to ambient : RθCA = 23°C/W

Lower value can be reached with the help of larger and

thicker copper metal, higher number of thermal via from top

to down side pcb and the use of additional thermal via from

the circuit board to the module case.

Steady State Thermal Model

The junction to ambient thermal resistance of the circuit

mounted on a printed circuit board can be split into two main

parts: junction to case and case to ambient resistances.

A simplified steady state model is shown in Figure 2.

Chan 1 Junction

Temp Node

(Volts represent Die

Surface Temperature)

Temp Node

Chan 2 Junction

Chan 1

Switch

Chan 2

Switch

2R°θCJC/W1

Chan 1

Power (W)

(1.0A=1W of

Power Dissipation)

Rthca

(1.0Ω=1°C/W)

25°C/W

RθJC2

2°C/W

Chan 2

Power (W)

Case Temp Node

Ambient Temp Node

(1.0V=1°C)

AmbientTemperature

Figure 4. Simplified Thermal Model (Electrical

Equivalent)

Analog Integrated Circuit Device Data

Freescale Semiconductor

33288

9

Share Link: