B57150K1 Просмотр технического описания (PDF) - TDK Corporation

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производитель

B57150K1

NTC thermistors for temperature measurement Leadless NTCs

TDK Corporation 

Temperature measurement and compensation

Leadless NTCs

Solder joint profiles for silver/nickel/tin terminations

B57150K1

K1150

1.3.3 Recommended geometry of solder pads

Recommended maximum dimensions (mm)

Case size A

B

C

inch/mm

0402/1005 0.6

0.6

1.7

0603/1608 1.0

1.0

3.0

0805/2012 1.3

1.2

3.4

1206/3216 1.8

1.2

4.5

1.3.4 Notes

Iron soldering should be avoided, hot air methods are recommended for repair purposes.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 9 of 17

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