IRF6626PBF Просмотр технического описания (PDF) - International Rectifier

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IRF6626PBF

DirectFET Power MOSFET

International Rectifier 

IRF6626PbF

Absolute Maximum Ratings

PD @TA = 25°C

PD @TA = 70°C

PD @TC = 25°C

TP

TJ

TSTG

e Power Dissipation

e Power Dissipation

f Power Dissipation

Parameter

Peak Soldering Temperature

Operating Junction and

Storage Temperature Range

Thermal Resistance

RθJA

RθJA

RθJA

RθJC

RθJ-PCB

Parameter

em Junction-to-Ambient

km Junction-to-Ambient

lm Junction-to-Ambient

fm Junction-to-Case

Junction-to-PCB Mounted

eà Linear Derating Factor

Max.

2.2

1.4

42

270

-40 to + 150

Typ.

–––

12.5

20

–––

1.0

0.017

Max.

58

–––

–––

3.0

–––

Units

W

°C

Units

°C/W

W/°C

100

10

1

0.1

0.01

D = 0.50

0.20

0.10

0.05

0.02

0.01

τJ τJ

τ1 τ1

R 1R 1

SINGLE PULSE

( THERMAL RESPONSE

Ci= τi/Ri

) Ci τi/Ri

R 2R 2

τ2 τ2

0.001

1E-006

1E-005

0.0001

0.001

0.01

R 3R 3

R 4R 4

τ3 τ3

τ4 τ4

0.1

Ri (°C/W) τi (sec)

R 5R 5

0.6677 0.000066

τAτ 1.0463 0.000896

τ5 τ5

1.5612 0.004386

29.2822 0.686180

25.4550 32

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthja + Tc

1

10

100

t1 , Rectangular Pulse Duration (sec)

Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient

Notes:

‰ Used double sided cooling , mounting pad.

Š Mounted on minimum footprint full size board with metalized

back and with small clip heatsink.

‹ Rθ is measured at TJ of approximately 90°C.

ƒ Surface mounted on 1 in. square Cu

(still air).

www.irf.com

‰ Mounted to a PCB with

small clip heatsink (still air)

Š Mounted on minimum

footprint full size board with

metalized back and with small

clip heatsink (still air)

3

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