ML7012-06 Просмотр технического описания (PDF) - LAPIS Semiconductor Co., Ltd.

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Компоненты Описание

Список матч

ML7012-06

2400 bps Single Chip Full Duplex Data Modem with Protocol

LAPIS Semiconductor Co., Ltd. 

PACKAGE DIMENSIONS

QFP64-P-1414-0.80-BK

FEDL7012-06-02

ML7012-06

(Unit: mm)

Mirror finish

5

Package material

Lead frame material

Pin treatment

Package weight (g)

Rev. No./Last Revised

Epoxy resin

42 alloy

Solder plating (J5μm)

0.87 TYP.

6/Feb. 23, 2001

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact ROHM's responsible sales person for the

product name, package name, pin number, package code, and desired mounting conditions (reflow

method, temperature and times).

21/23

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